Plastic electronic component package

ABSTRACT

A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit under 35 U.S.C. §119(e) of U.S.Provisional Patent Application No. 60/874,450, filed on Dec. 12, 2006,the disclosure of which is incorporated by reference herein.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

N/A

BACKGROUND OF THE INVENTION

Image sensors such as those used in digital cameras and other optical orimage sensing equipment are conventionally housed in a ceramic package.The ceramic package includes a ceramic frame which is epoxy bonded to aglass lid or cover. The ceramic package is expensive and not readilyadapted to manufacture in strip form or other multiple unit form, as iswidely employed in the semiconductor packaging industry. In addition,the use of epoxy as a bonding agent presents several problems such asmoisture penetration through the epoxy bond, outgassing of the epoxywhich can contaminate the semiconductor device, and air leakage whichlimits the ability to hermetically seal the ceramic package. Further, itis difficult to accurately align the glass cover to the ceramic frame sothat the glass cover is parallel to the image sensor surface. Thisalignment difficulty is caused by an inability to control the thicknessof an epoxy bead which is commonly employed to seal the glass lid to theceramic frame.

A conventional ceramic sensor package is shown in sectional elevationview in FIG. 1. This package includes a two layer ceramic substratecomposed of an outer ceramic substrate 10 and an inner ceramic substrate12, on the upper surface of which is disposed a CCD or CMOS image sensor14. A ceramic frame 16 defines the cavity 18 in which the image sensoris located. The ceramic frame is hermetically sealed to the peripheralsurface of the substrate 10 and a boro-silicate glass lid or window 20is sealed to the upper surface of frame 16 by a UV curable adhesive. Thecontacts of the image sensor are wire bonded to contacts 22 provided onthe inner surface of substrate 10. These contacts 22 are electricallyconnected to outer contact pads 24 by conductive feedthroughs or viasprovided in substrate 10. The feedthroughs 26 are typically plated withgold to enhance the electrical conduction between the inner and outercontact areas. A UV curable adhesive is usually employed to bond theglass window to the ceramic package frame to prevent exposure of thesemiconductor sensors to high temperatures which are needed to cureother types of epoxy adhesives but which can degrade or destroy thesemiconductor sensors. The requirement for UV curable adhesive materialslimits the range of available epoxies which can be employed in theconventional ceramic package, since most epoxy adhesives are curable atelevated temperatures.

The reliability of semiconductor and other electronic device orcomponent packages including image sensor packages is related to the“airtightness” or hermeticity of the package. Hermeticity is a measureof an ability of the package to protect the semiconductor or otherdevice housed in the package from an entrance of fluids and moisture.Moisture or corrosive gases on or near a semiconductor device can causecorrosion of the metallic traces on the semiconductor device, and canlead to failure. Traditional hermetic packages are made from metal,ceramic, or vitreous materials. These materials have such lowpermeabilities that moisture and fluids typically are impeded by thesematerials, and cause a condensation on the semiconductor device orcontamination by corrosive gasses.

In addition to a permeation of fluids or moisture, fluids or moisturecan penetrate the image sensor package though “leaks” at severalinterfaces. The interfaces for a ceramic package include a metal/ceramicinterface, along with epoxy/glass and epoxy/ceramic interfaces. Anysmall openings at these interfaces allow fluids or moisture to seepinside the image sensor package.

BRIEF SUMMARY OF THE INVENTION

The image sensor package according to the present invention eliminatesthe need for ceramic components and employs a plastic material whichpreferably is a high temperature liquid crystal polymer (LCP) material.The package is useful not only for image sensors but also for otherlight sensing or light emitting semiconductor or other devices orcomponents. A package in accordance with the invention can also be usedto contain non-optical devices or components.

The image sensor package comprises a plastic body or frame, preferablyof LCP material, molded around a metal leadframe and defining a cavityin which the image sensor is to be disposed. The leadframe has a centralportion in the cavity on which the image sensor is mounted, and aplurality of leads which are connectable to contact areas of the sensor.A lid assembly is provided having a transparent glass lid retained in alid frame which is also made of plastic, preferably LCP material. Thelid frame is weldable or otherwise bondable to the plastic frame of thepackage to enclose the image sensor mounted in the cavity. The leadframeis usually composed of copper or a copper alloy, or a ferrous alloyhaving a copper coating. An interfacial layer is formed on the surfacesof the leadframe at least in those portions which are in contact withthe plastic frame. This interfacial layer serves to providesubstantially improved adhesion between the leadframe and the plasticmaterial and to achieve a hermetic bond between the metal and plasticmaterials. The interfacial layer is composed of a cuprous oxide baselayer formed on a surface of the leadframe, and a cupric oxide layerformed on the cuprous oxide layer. The cupric oxide outer layer has anacicular structure which provides an interlocking mechanism for adhesionto the plastic material molded thereto in forming the package.

In another aspect of the invention a hermetic seal and sealing techniqueis provided between a metal element and a plastic element which utilizesan interfacial or intermediate layer between the metal element andplastic element and which comprises a first oxide base layer forproviding strong adhesion to the metal material and a second oxide layerformed on the first oxide base layer and having an acicular structurefor strong adhesion to the plastic material.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The invention will be more fully described in the following detaileddescription taken in conjunction with the accompanying drawings inwhich:

FIG. 1 is a cutaway elevation view of a ceramic package of conventionalconstruction;

FIG. 2A shows an image sensor package made in accordance with theinvention;

FIG. 2B shows the bottom of the package of FIG. 2A;

FIG. 3 shows a leadframe strip used in the package of the invention;

FIG. 4A is a cutaway perspective view of the lid assembly;

FIG. 4B is a perspective view of the lid assembly;

FIG. 4C is a cutaway elevation view of the assembly of FIG. 4A;

FIG. 5 is a cutaway elevation view of the ultrasonically welded imagesensor package;

FIG. 6 are photomicrographs showing the interfacial layer between thecopper leadframe and package frame material;

FIG. 7 is a diagrammatic elevation view of the interfacial layer;

FIG. 8A is a flowchart illustrating the steps of package fabrication;

FIG. 8B is a flowchart illustrating the steps of lid assemblyfabrication;

FIG. 9 is a flowchart of the steps typically employed by a manufacturerin attaching a device in the package;

FIG. 10 is a photomicrograph illustrating dye leaking through aconventional LCP package which is non-hermetic;

FIG. 11 is a photograph of the top and bottom of a hermetic LCP packageof the invention, after leakage testing; and

FIG. 12 is a graph illustrating the permeability of packaging materials.

DETAILED DESCRIPTION OF THE INVENTION

The package, materials and method of package fabrication are describedin a preferred embodiment for an image sensor. The invention is not tobe limited to image sensor packages or packages for other opticaldevices, but is more broadly useful for housing other semiconductor,electrical and electronic devices, components or circuits.

The package configuration can be of various forms to suit particularpackaging requirements. The package configuration may vary in size andshape and can include electrical lead configurations of many differentforms. The invention is not to be limited to any particular package typeor configuration. The invention will be described in the context of apackage for a semiconductor image sensor chip such as used in digitalcameras and other digital imaging systems and devices.

The image sensor package in accordance with the invention comprises ahigh temperature thermoplastic body or frame, preferably an LCPmaterial, molded around a metal leadframe. An image sensor chip ismounted in a cavity of the package on a central portion of the leadframeand the chip is wirebonded or otherwise connected to leads of theleadframe. A lid assembly comprised of a glass lid retained in a hightemperature thermoplastic frame, also preferably an LCP material, isattached to the package frame after the sensor chip has been mounted inthe cavity of the package. The frame of the lid assembly isultrasonically welded to the plastic frame of the image sensor packageto provide a hermetically sealed enclosure for the sensor. The glass lidis chemically bonded to the plastic frame of the lid assembly,preferably by thermal bonding. Alternatively, the glass lid can beinsert molded to the lid assembly frame. The glass is of optical qualityand is transmissive in the optical spectrum of interest. For aphotographic sensor, the glass is transmissive to the visible lightspectrum. For other purposes, such as for certain LED packages, theglass is transmissive to UV light.

An image sensor package according to the invention is shown in pictorialview in FIG. 2A and bottom view in FIG. 2B. The plastic frame or body 30defines a cavity area in which the image sensor is mounted on the coppersurface 32 provided by the leadframe. Copper leads 34 provided about theperiphery of the cavity extend through the molded body to positions 36on the bottom of the leadframe as shown in FIG. 2B.

A leadframe is fabricated of copper or copper alloy using conventionalmethods (e.g., etching or plating). For reasons of cost andmanufacturing ease, the leadframe is usually fabricated in a reel. Theleadframe is exposed to a treatment, described below, to improveadhesion for molding with the plastic material. This treatment can beperformed in either reel-reel or strip format.

A portion of a leadframe strip is shown in FIG. 3 in which six leadframeunits 40 are disposed across the width of the strip 42. In oneembodiment, six package bodies are molded simultaneously across thewidth of the leadframe strip. The leadframe strip is then advanced, andan additional six bodies are molded to the array of leadframes disposedacross the width of the strip. In similar manner, the leadframe strip ispopulated with package bodies and the strip is wound onto a continuousreel. Alternatively, the reel can be separated into strips of intendedlength and width to suit user requirements. In a further alternative,the package bodies molded to each leadframe unit are separated orsingulated into individual units which are then supplied to a user foruse in packaging the sensor.

The lid assembly is shown in FIGS. 4A-4C. The lid assembly comprises ahigh temperature plastic frame 50, preferably an LCP material. A glasslid 52 is chemically bonded to the plastic frame 50 preferably bythermal bonding to provide a hermetic seal between the glass lid andplastic frame. The glass lid is preferably a boro-silicate glass ofoptical quality to provide appropriate light transmission to the imagesensor housed within the package. The frame 50 has a recessed shelf areaas shown in which the lid 52 is disposed. The lid is bonded to the shelf53. The plastic frame has a peripheral configuration 54 which iscomplementary to a configuration provided about the periphery of theplastic frame of the package, as seen in FIG. 5. The lid assembly isultrasonically welded at these mating configurations of the lid frameand package frame to provide an ultrasonic seal. The sealed package withthe lid assembly bonded to the package frame or body is shown in FIG. 5.

The leads are preferably made of an alloy of copper including iron in arange between about 2.1% and about 2.6%, phosphorus in a range betweenabout 0.015% and about 0.15%, zinc in a range between about 0.05% andabout 0.2%, with the balance being copper. Other combinations of thesematerials are, however, acceptable. The leads are more preferably madeof about 97.5% copper, about 2.35% iron, about 0.3% phosphorus and about0.12% zinc. Such an alloy is available from Olin Corporation under theUNS designation C19400.

Alternatively, the leads can be made of a ferrous alloy such as alloy 42which is a nickel-iron alloy. Copper is plated onto the surfaces of theleadframe prior to molding of the plastic body or frame to theleadframe.

The package body or frame is a thermoplastic material which preferablyis a high temperature liquid crystal polymer (LCP) material. The plasticframe of the lid assembly is also preferably an LCP material. For manyapplications, the package body is composed of a Type I LCP materialwhich has a relatively high melting temperature in the range of 300-350°C. This high temperature material is beneficial to withstand thetemperatures employed for gold-tin die-attach which is often used forattachment of the image sensor chip to the copper substrate of thepackage. For other applications, such as for lead free solderdie-attach, a Type II LCP material can be used which has a meltingtemperature in the range of about 280-320° C.

The LCP composition includes filler particles which are added fordimensional stability, adjustment of coefficient of thermal expansion(CTE), adjustment of anisotrophy, lower permeability, attaining a smallparticle size to reduce contamination by dust, and optimizing theirhermetic sealing. The filler particles can include talc, glass,graphite, titanium dioxide, calcium carbonate, mica, boron nitride,quartz, and fused silica. The particles may be in the form ofnanospheres, or platy structures which are of flat plate-likeconfiguration. A blend of such particles forms may also be employed. Inone composition, the filler particles are talc in the form of a 50%blend of platy structures and nanospheres. The talc particles may beless than 1 micron in diameter or width or may be in a larger size rangeof about 1-3 microns. The platy structure of the particles interactswith the LCP molecules to provide some “bending” in the molecule whichhelps decrease anisotrophy. Talc in the range of about 30-50% by weightin the LCP composition is one preferred range to optimize the CTE of thematerial. Preferably the CTE of the LCP material should be in the rangeof about 6 ppm/° C.-25 ppm/° C. to be compatible with the CTE of theleadframe. The filler particles of nano size are useful in enhancing thehermetic sealability of the material to the leadframe. In anothercomposition, glass is used in various combinations of geometrical sizes,including fibers, milled glass, and flakes.

The frame of the lid assembly is also preferably an LCP material havingfiller particles preferably in the range of about 10-30% by weight.

Examples of LCP material compositions are shown in Table 1.

TABLE 1 Glass Milled Flake Sample Polymer Talc % Fiber % Glass % Glass %1 Polymer 10-40% 2 Polymer 30 10 3 Polymer 45 4 Polymer 10 35 5 Polymer15 15 6 Polymer 20 20 7 Polymer 25 25 Polymer Composition ThermotropicLCP Containing the following repeat units hydroquinine (HQ) teraphalicacid isophalic acid 2,6 naphalene dicarboxyclic acid 4-hydrobenzoic acid(HBA) bisphenol or biphenol (BP) hydroxynaphthoic acid Talc = magnesiumsilicate hydroxide, pophyllosilicate Glass Fibers = sio2, CaO, Al203,B2O3, length 4000-13,000 microns Milled glass (same composition) 50-350microns Flaked glass (same composition)

In order to enhance the adhesion of the leadframe to the LCP packageframe and to provide better hemeticity, an interfacial or intermediatelayer is provided on the surfaces of the leadframe at least in the areasof the leadframe to which the plastic material is to be molded. Thisinterfacial layer is composed of two sub-layers; namely, a base layer ofcuprous oxide formed on the leadframe or intended portions thereof, anda cupric oxide layer formed on the cuprous oxide layer. The cupric oxideouter layer has an acicular, dendritic or needle like structure whichprovides an interlocking mechanism for adhesion to the plastic materialmolded thereto in forming the package. Typically, the entire leadframeis coated prior to molding with the interfacial material. After moldingof the frame to the leadframe, the exposed portions of the intermediatelayer material outside the areas of the molded package body are removed.

The interfacial layer is provided by a chemical conversion process bywhich the copper surfaces of the leadframe are oxidized under processconditions which allow the cuprous oxide base layer and cupric oxideouter layer to form. Under the appropriate conditions, the cuprous oxideand cupric oxide layers grow or form substantially simultaneously. Anoxidizing material is employed such as a chemical oxidizer which hasbeen modified by the addition of an alkaline solution of, for example,sodium chloride in an amount to provide a reaction temperature which isgreater than about 125° F. The reaction time and temperature afterapplication of the oxidizing material to the leadframe determines thegrowth of the two interfacial layers. The reaction time is greater thanabout ten minutes. In one embodiment, the reaction time after exposureof the leadframe to the oxidizing solution is about twenty minutes at atemperature of about 212-216° F. The leadframe is typically immersed ina bath of oxidizing solution to provide the interfacial layer.

The interfacial layer has a thickness in the range of about 1-10microns. The base layer is thinner than the cupric oxide layer in aration of about 1:5, although this range can vary under various processconditions. The oxide material is of high density and has high adhesionstrength to the copper on which it is formed. This dual oxide layerserves to relieve stress in the interfacial layer and can withstandtemperatures of at least 400° C. to avoid cracking or other degradationof the oxide which could otherwise occur during molding of the packagebody to the leadframe or by die-attach temperatures which may beemployed in attaching the image sensor or other chip to the packagemounting surface. The acicular structure of the cupric oxide coatingtypically has a random pattern. The cupric oxide also providesprotection for the underlying cuprous oxide layer which is in contactwith the copper. Such protection is by shielding the underlying layerfrom damage by hot temperatures which are present in molding the packageand during die attach, and which can cause degradation of thecopper/oxide interface.

The plastic package body molded to the leadframe which has been providedwith the interfacial layer achieves a moisture resistant andhermetically sealed bond between the plastic body and the leadframe. Thesubsequent bonding of the lid assembly to the package body, afterinstallation of the image sensor in the package cavity, also provides amoisture resistant and hermetically sealed bond between the package bodyand lid assembly thus resulting in a hermetically sealed package.

The interfacial layer 60 is seen in the photomicrographs of FIG. 6 whichshows cross-sections of the LCP package body material bonded to thecopper leadframe. The interfacial layer, composed of the cuprous oxidelayer formed on the copper surface and the cupric oxide layer formed onthe cuprous oxide base layer, has the following properties and benefits.The cuprous oxide forms a strong bond to the copper leadframe and isresistant to delamination. The acicular topography of the cupric oxidereduces surface tension to promote wetting of the LCP for adhesion andenhanced surface roughness for increasing the surface area for bondingof the LCP material. The cupric oxide also provides an inert top surfacewhich impedes contamination and an inorganic low permeability materialfor moisture resistance.

The interfacial layer 60 is illustrated in the diagrammatic view of FIG.7 and shows a cuprous oxide base layer (Cu₂O) 62 for strong adhesion tocopper leadframe 64, and cupric oxide layer (CuO) 66 having an acicularor dendritic structure 48 and which is molded to the LCP packagematerial.

As stated above, the layer can be provided by a chemical conversionprocess, which can be implemented in a standard in-line bath. Theleadframe can typically be in rack or reel-reel format.

This interfacial layer can be used with ferrous metals and alloys, aswell as the copper described above. Such an interfacial layer can alsobe used as an interface between other metal and thermoplastic materials.By use of this interfacial layer, a metal element can be hermeticallysealed to a thermoplastic element for a variety of purposes in which ahermetic seal is required between the metal and plastic components. Onesuch purpose is for hermetically sealed electronic packages as describedherein, but is more broadly useful for a variety of electrical,electronic, mechanical and other structures where a hermetic or nearhermetic seal is desired between metal and plastic materials.

FIG. 8A shows the steps of making the image sensor package. Theleadframe is made by stamping or chemical etching in step 70. Aninterfacial layer is formed on the leadframe in step 72, at least in theportions to be molded to the LCP material. The LCP material is molded tothe leadframe in step 74 to create the package cavity. The leadframe isplated in intended portions, such as the leads thereof, in step 76. Instep 78, the image sensor package may be singulated into individualpieces or packed in a strip or reel form.

The fabrication of the lid assembly is shown in FIG. 8B. A piece ofglass is sawed or otherwise cut to a desired size in step 80. Aringframe of LCP material is made by injection molding in step 82. Theglass lid is attached to the ringframe by a process of thermalattachment, such as thermal bonding in step 84. The lid may be attachedto the lid frame by other techniques, such as insert molding.

FIG. 9 shows the steps a customer, or an end-user, may take for mountingan image sensor device in the image sensor package. In step 90, thedevice is bonded to the copper mounting surface of the package cavity.The device contacts are wirebonded to potential contacts of the package,in step 92. The lid assembly is attached to the package frame such as byultrasonic welding in step 94. The completed package is singulated instep 96, if fabrication was in strip form.

The package constructed in accordance with the invention achieves ahermeticity which is comparable to conventional and more expensiveceramic packages. The performance of the present invention in meetingstringent hermeticity requirements is described below.

The traditional method of evaluating the hermeticity of a cavity packageis by performing a helium leak test (MIL-STD-883). In this test, asealed package is placed in a helium pressurized vessel (termed “bomb”).Some helium will enter the cavity package though one of the “leak”channels. After removal of the cavity package from the bomb, the cavitypackage is connected to a helium leak tester, and the leak rate of thecavity package is detected. The amount of helium released depends uponthe size of the “leak” channel and the helium pressure within the cavitypackage. The helium pressure in the cavity package depends upon theamount of helium and the internal volume of the cavity package. Thelevels of hermeticity are governed by MIL-STD-883 test condition 1014.The following are the hermetic rating and test methods:

(i) Test Condition A: Fine Leak using helium tracer gas:

-   -   A1: Fixed Method    -   A2: Flexible Method    -   A4: Open Can Leak for Unsealed Packages

(ii) Test Condition B: Fine Leak using Radioactive Tracer Gas

(iii) Test Condition C: Gross Leak and Fine Leak Test Techniques

-   -   C1: Gross Leak Bubble Test    -   C3: Gross Leak Vapor test    -   C4/C5: OLT Optical Leak Detection (Gross and Fine Leak)

(iv) Test Condition D: Gross Leak using a Dye Penetrant (Destructive)

(v) Test Condition E: Gross Leak by Weight Gain Measurements

To be designated as a hermetic package, the helium leak rates of acavity package must meet the following criteria shown in Table 2:

TABLE 2 Helium Leak Rates and Hermetic Ratings Maximum Leak Rate, (atm-Package Volume, (cc) cc/sec) <=.01 5 × 10⁻⁸ 0.01 < V <= 0.4 1 ×10⁻⁷ >0.4   1 × 10⁻⁶

The flow of helium and other gases through a fine leak is molecularbecause of the fine leak channel. The number of molecules striking aunit area of surface is proportional to the pressure of the gas andinversely proportional to the square root of its molecular weight. Belowin Table 3 are the properties of several molecular species (gasses) ofinterest for the image sensor package, as it is desirable to protect theimage sensor package from such molecular species:

TABLE 3 Properties of Gases Molecular Viscosity Molecular MolecularWeight Diameter Micro-Poise @ Mass Species (Gram) (×10⁻⁸ cm) 20 Celsius(×10⁻²⁴ Gram) Helium 4.0 2.2 194 6.64 Neon 20.2 2.6 311 33.5 Argon 40.03.7 222 66.2 Nitrogen 28.0 3.8 177 46.5 Oxygen 32.0 3.6 202 53.1 Air28.7 3.7 184 47.6 Water 18.0 3.2 125 @ 100 29.9 Celsius Carbon 44.0 4.6148 73.0 Dioxide

For an image sensor package to be compliant with MIL-STD-883D testing,leakage due to openings at an interface should be small.

For the image sensor package to pass the Gross Leak Test Condition C1:MIL-STD-883, the following applies:

-   -   Helium Leak Rate <=1×10⁻⁵ atm-cc/sec and    -   Leak channels with a cross sectional dimension greater than        1×10⁻⁴ cm will cause the image sensor package to fail this test.

FIG. 10 shows the interfacial problems associated with a plastic moldedLCP image sensor package using a standard LCP material. Adhesion of thismaterial to the leadframe is non-optimum, and dye inserted in the cavitywill leak through the LCP/Leadframe interface. This package withconventional plastic material will not meet the applicable industrystandard. (MIL-STD-883, Test Condition D: Gross Leak using a DyePenetrant).

For comparison, FIG. 11 shows the construction of the present inventionafter the dye leak test. The dye penetrant did not leak through theLCP/leadframe interface, allowing this package to meet the MIL-STD-883standard.

FIG. 12 shows several materials which are used in semiconductorpackaging. In non-hermetic packages, polymers are used which have apermeability such that fluids and moisture can penetrate easily. Inhermetic packaging, materials are used which are relatively imperviousto fluids and moisture. As can be seen, the permeability of the“non-hermetic” materials is high, such that fluids and moisture canrelatively easily penetrate the package. Glass, ceramic, and metal haverelatively low permeability, allowing for them to be suited for hermeticpackaging. Also shown is the measured permeability of the LCPformulation used for the image sensor package of the present invention.The permeability of the LCP formulation is equivalent to glass, makingit most suitable for “hermetic” packaging.

As the package constructed in accordance with the invention ishermetically sealed, the package can be employed to house componentssuch as LEDs which may include a liquid or gel filled interior. For suchpurposes, the present package avoids leakage of the gel which can occurin conventional packages which are not adequately sealed.

While the invention has been described for use in an image sensorpackage, the invention is not limited to image sensor packages oroptical packages but is useful for providing a plastic package forcontaining other semiconductor, electric or electrical components,devices or circuits. For applications where a glass lid is not needed,the lid assembly can be molded in one piece which includes the lid orcover portion and surrounding frame which is bondable to the packageframe. In addition, the interfacial layer of the present invention isnot limited to use between a leadframe and a plastic frame but is moregenerally useful as an interfacial layer between a metal and a plasticin other than circuit or device packages. Accordingly, the invention isnot to be limited by the embodiments shown and described but is toembrace the full spirit and scope of the accompanying claims.

1. An image sensor package comprising: a plastic frame molded around ametal leadframe and defining a cavity; the leadframe having a centralportion in the cavity and a plurality of leads; the central portion ofthe leadframe in the cavity adapted to have an image sensor mountedthereon and connected to the plurality of leads; a lid assembly having atransparent lid retained in a plastic lid frame; and the lid frame beingweldable to the plastic frame to enclose an image sensor mounted in thecavity.
 2. The image sensor package of claim 1 wherein the plastic frameand the lid frame are each a high temperature thermoplastic material. 3.The image sensor package of claim 2 wherein the plastic frame and thelid frame are each a high temperature LCP material.
 4. The image sensorpackage of claim 2 wherein the LCP material has a melting temperaturegreater than about 300° C.
 5. The image sensor package of claim 2wherein the LCP material has a melting temperature greater than about200° C.
 6. The image sensor package of claim 2 wherein the LCP materialcontains filler particles to provide a CTE compatible with that of themetal lead frame.
 7. The image sensor package of claim 6 wherein the CTEof the LCP material is in the range of about 6-25 ppm/° C.
 8. The imagesensor package of claim 6 wherein the filler particles are of nano size.9. The image sensor package of claim 6 wherein the filler particles arein the range of about 10-17% by weight.
 10. The image sensor package ofclaim 2 wherein the leadframe is copper.
 11. The image sensor package ofclaim 2 wherein the leadframe is a copper alloy.
 12. The image sensorpackage of claim 2 wherein the leadframe is a ferrous metal havingcopper surfaces.
 13. A method of fabricating an electronic componentpackage, the method comprising the steps of: providing a metalleadframe; providing on at least a portion of the surfaces of the metalleadframe an interfacial layer of oxide material; molding a plasticframe around the portion of the metal leadframe having the interfaciallayer, the frame defining a cavity; the leadframe having a centralportion in the cavity and a plurality of leads; mounting an electroniccomponent on the central portion of the leadframe in the cavity andconnecting the component to the plurality of leads; providing a lidassembly having a transparent lid bonded to a plastic lid frame; andwelding the lid frame to the plastic frame to enclose the component. 14.A hermetically sealable electronic component package comprising: a hightemperature plastic frame molded to a metal leadframe and defining acavity; the leadframe having a central portion in the cavity and aplurality of leads; the central portion of the leadframe adapted to havean electronic component mounted thereon and connected to the pluralityof leads; a lid assembly having a lid of high temperature plasticretained in a lid frame of high temperature plastic; and the lid framebeing weldable to the plastic frame to enclose an electronic componentmounted in the cavity.
 15. The package of claim 14 wherein the metalleadframe has on the surfaces thereof which are molded to the plasticframe an interfacial layer of material effective to improve the adhesionof the high temperature plastic frame to the metal leadframe.
 16. Thepackage of claim 14 wherein the leadframe is composed of copper; andwherein an interfacial layer is formed on at least the surfaces of theleadframe in contact with the plastic frame, the interfacial layercomposed of a cuprous oxide layer formed on the surface of the leadframeand a cupric oxide layer formed on the surface of the cuprous oxidelayer.
 17. The package of claim 15 wherein the interfacial layer has: afirst layer formed on a surface of the metal leadframe; and a secondlayer formed on a surface of the first layer, the second layer having asurface bonded to the high temperature plastic frame.
 18. The package ofclaim 15 wherein the leadframe has a copper surface; the interfaciallayer has a first layer of cuprous oxide formed on the copper surface ofthe leadframe; and a layer of cupric oxide formed on a surface of thecuprous layer, the cupric layer having an acicular structure bonded tothe high temperature plastic frame.
 19. For use in fabricating ahermetically sealed electronic package having a high temperature plasticframe molded to a copper leadframe and defining a cavity, a leadframecomprising: a first layer of cuprous oxide formed on the surfaces of theleadframe at least at the portions to be molded to the high temperatureplastic frame; and a second layer of cupric oxide formed on the firstlayer and having an acicular structure bondable to the high temperatureplastic frame.
 20. A hermetic seal between a metal element and a plasticelement comprising: an intermediate layer between the metal element andthe plastic element, the intermediate layer having: a layer of a firstoxide formed on a surface of the metal element; and a layer of a secondoxide formed on the layer of a first oxide, the second oxide layerhaving an acicular structure bondable to the plastic element.
 21. Thehermetic seal of claim 20 wherein: the first oxide is an oxide of themetal material of the metal element; and the second oxide is a differentoxide form of the first oxide.
 22. The hermetic seal of claim 21wherein: the metal element has a copper surface at least in the areabondable to the plastic element; the first oxide is cuprous oxide andthe second oxide is cupric oxide.
 23. For use in a hermetically sealableplastic electronic component package having a plastic frame moldedaround a metal leadframe and defining a cavity in which an electroniccomponent is mountable, a lid assembly comprising: a lid sized andconfigured to cover the cavity of the plastic frame of the package; anda plastic lid frame bondable to the lid and weldable to the plasticframe of the package to enclose and hermetically seal the packagecavity.
 24. A method of constructing a lid assembly having a transparentlid bonded to a plastic lid frame, the method comprising the steps of:sawing a transparent lid to a predetermined size; injection molding aplastic lid; and attaching the transparent lid to the plastic lid bythermal bonding.
 25. A method of constructing a lid assembly having atransparent lid bonded to a plastic lid frame, the method comprising thesteps of: sawing transparent lid to a predetermined size; and injectionmolding a plastic lid directly onto the transparent lid by overmolding.26. A method of thermally bonding a transparent lid to a plastic lidframe, the method comprising the steps of: heating the transparent lidin a fixture; heating the plastic lid in a mating fixture; mating thetransparent lid and the plastic lid to a fixed displacement such thatthe material of the plastic lid contacts the transparent lid and locallymelts to it; and cooling the assembly in place.
 27. The method of claim13 wherein the step of welding the lid frame to the plastic framecomprises ultrasonic welding of the lid frame to the plastic frame; andwherein the ultrasonic welding is applied only to the perimeter of thelid frame.
 28. A method of fabricating an electronic component package,the method comprising the steps of: providing a metal leadframe;providing on at least a portion of the surfaces of the metal leadframean interfacial layer of oxide material; molding a high temperaturethermoplastic frame around the portion of the metal leadframe having theinterfacial layer, the frame defining a cavity; the leadframe having acentral portion in the cavity for mounting an electronic component, anda plurality of leads connectable to the electronic component; providinga lid assembly having a transparent lid bonded to a high temperaturethermoplastic lid frame; and welding the lid frame to the plastic frameto enclosed the component mounted in the cavity.
 29. The method of claim28 wherein the LCP material contains hydroquinine (HQ), teraphalic acid,isophalic acid, 2, 6 naphalene, dicarboxyclic acid, 4-hydrobenzoic acid(HBA), bisphenol or biphenol (BP), and hydroxynaphthoic acid; and fillerparticles of at least one of the group consisting of talc, glass fiber,milled glass and flake glass.
 30. The method of claim 29 wherein thefiller particles are in the range of 10-50% by weight.
 31. The method ofclaim 30 wherein at least some of the filler particles have a particlesize in the range of about 50-350 microns.
 32. The method of claim 28wherein the step of providing an interfacial layer includes providing afirst oxide on at least a portion of the surfaces of the metalleadframe, and providing a second oxide on the first oxide.
 33. Themethod of claim 32 wherein the step of providing the interfacial layerincludes providing the interfacial layer on the entire surface of theleadframe; and further including the step of removing the exposedportions of the interfacial layer from the leadframe after molding thehigh temperature thermoplastic frame.
 34. The method of claim 28 whereinthe metal leadframe is copper and wherein the interfacial layer iscopper oxide material.
 35. The method of claim 28 wherein the step ofmolding comprises injection molding the high temperature thermoplasticframe; wherein the step of providing a lid assembly comprises injectionmolding the lid frame and bonding the transparent lid thereto.
 36. Themethod of claim 28 wherein the step of welding comprises ultrasonicwelding the lid frame to the plastic frame.